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LAUNCHXL-F280049C_TI(德州仪器)中文资料_英文资料_价格_PDF手册

2025-04-26 16:17:49

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LAUNCHXL-F280049C

LAUNCHPAD TMS320F280049C EVAL BD

The C2000 LAUNCHXL-F280049C a low-cost development board for the Texas Instruments Piccolo F28004x series of microcontrollers (MCUs). It is designed around the TMS320F280049C MCU and highlights the control, analog, and communications peripherals, as well as the integrated nonvolatile memory. The LaunchPad also features two independent BoosterPack XL expansion connectors, on-board Controller Area Network (CAN) transceiver, 5 V encoder connectors, FSI connector, and an on-board XDS110 debug probe.

Figure 1 highlights the key features of the Piccolo F28004x LaunchPad.

1 Board Overview

1.1 Kit Contents

The Piccolo F28004x Series LaunchPad Development Kit contains these items:

• C2000 Piccolo F28004x Series LaunchPad development board (LAUNCHXL-F280049C)

• USB micro-B plug to USB-A plug cable

• Two LaunchPad Stickers

1.2 Features

The F28004x LaunchPad has these features:

• C2000 Piccolo Series F280049CPZS microcontroller:

– Enabled for InstaSPIN-FOC ™ motor control and Configurable Logic Block (CLB) capability

• On-board XDS110 debug probe

• Two user-controlled LEDs

• One microcontroller reset switch

• Selectable power domains:

– USB (isolated)

– BoosterPack

– External power supply

• CAN connectivity with on-board CAN transceiver

• Two independent Enhanced Quadrature Encoder Pulse (QEP)-based encoder connectors

• Separate FSI connector

• Two independent BoosterPack XL standard connectors featuring stackable headers to maximize expansion through the BoosterPack ecosystem

1.3 Specifications

Table 1 summarizes the F28004x LaunchPad specifications.

1.4 Using the F28004x LaunchPad

The recommended steps for using the F28004x LaunchPad are:

1. Follow the README First document included in the kit. The README First document helps you run the LaunchPad. Within just a few minutes, you can control and monitor the F28004x LaunchPad with the pre-programmed quick start application. Additionally, Section A.1, the FAQ section included in this document can be helpful if there are any issues that might quickly be addressed.

2. Experiment with BoosterPacks. This development kit conforms to the latest revision of the

BoosterPack pinout standard. It has two independent BoosterPack connections to enable a variety of expansion opportunities. For more information about the TI LaunchPad and BoosterPack standard, see the TI LaunchPad web page at http://www.ti.com/launchpad.

3. Take the first step towards developing your own control applications. The F28004x LaunchPad is supported by the C2000Ware development package. After C2000Ware is installed, look for

f28004x\examples\launchpad in the installation directory. You can find pre-configured example

applications for this board as well as for this board with selected BoosterPacks. Any of the other

examples found withing the f28004x\examples directory can be used with minor modifications to run on the LaunchPad as well. For more details about software development, see Section 3.

4. Customize and integrate the hardware to suit your end application. This development kit can be used as a reference for building your own custom circuits based on C2000 Piccolo Series

microcontrollers or as a foundation for expansion with your custom BoosterPack or other circuits. This document can serve as a starting point for this endeavor.

5. Get Trained. You can also download hours of written and video training materials on this and related LaunchPads. For more information, visit the C2000 Real-Time Control MCUs - Support & Training

page.

1.5 BoosterPacks

The LAUNCHXL-F280049C provides an easy and inexpensive way to develop applications with the

F28004x Series microcontroller. BoosterPacks are add-on boards that follow a pin-out standard created by Texas Instruments. The TI and third-party ecosystem of BoosterPacks greatly expands the peripherals

and potential applications that you can easily explore with the F28004x LaunchPad.

You can also build your own BoosterPack by following the design guidelines on TI’s website. Texas

Instruments even helps you promote your BoosterPack to other members of the community. TI offers a variety of avenues for you to reach potential customers with your solutions.

1.6 InstaPIN-FOC ™

The LAUNCHXL-F280049C includes the Piccolo TMS320F280049C that has the superset configuration of features enabled, including InstaSPIN-FOC sensorless motor control technology. A library is included in on-chip ROM that can be accessed by a set of software APIs as demonstrated by projects included in

C2000Ware MotorControl Software Development Kit (available 2018Q4).

InstaSPIN-FOC technology identifies motor parameters, self-tunes the sensorless FAST™ observer, sets stable tuning for the current controllers, and allows you to quickly control your own three-phase motors under advanced, high-performance field oriented vector control (FOC) without the need for mechanical rotor sensors.

1.7 Hardware Revisions

This section contains an abbreviated revision history of the EVM as well as known issues with each revision.

1.7.1 Revision A

The first production revision of the LAUNCHXL-F280049C was released in July 2018. This revision can be identified by the "MCU025A" silkscreen labeling on the backside of the EVM between the BoosterPack

Connector site 1 towards the top of the board.

Various issues and concerns have been Identified on the EVM as listed below:

Known issues:

• There is contention on the primary side power of the USB Isolation IC, ADUM3160 (U3). As VBUS1 is connected to a 5 V supply (USB_VBUS), the internal regulator of the ADUM3160 will provide 3.3 V

internally, with the VDD1 pin being an output. In this revision, USB_VCC, a 3.3 V supply, is connected to VDD1 leading to the contention. Any fluctuation of either 3.3 V supply (USB_VCC and ADUM3160 VDD1) may cause currents to be sourced or drawn from either supply. This is a long term reliability

concern for both U3 and U101.

• On the PCB, the J6 and J8 labeling is swapped on the silkscreen. J6 is marked as the inner row (pins 71-80) and J8 is marked as the outer row (pins 51-60). This is incorrect and J6 should be on the outer row with (pins 51-60) and J8 is the inner row (pins 71-80).

• Similar to the above, on the MCU025A_Connectors.SchDoc, J6 and J8 should be swapped. In the schematic symbol J8 should be above Pins 31-40, while J6 should be above pins 11-20.

• Similar to the PCB silkscreen and the schematic, the Quick Start Guide insert has the pin numbers for 51-60 listed as J8 and 71-80 listed as J6. This is incorrect; the pin numbers should be swapped.

Special notes and considerations to be aware of:

• A precision reference (U11) is connected to VREFA+ (pin 9) of the TM4C129x device (U2 - the

XDS110 MCU). This is not necessary for the operation of the debug probe. VREFA+ (pin 9) can be safely connected directly to VDDA (pin 8). There are no issues with the current configuration; it is an opportunity for BOM cost/simplification for those seeking to replicate this design on their own.

• The EMU package 8.0.903.4 has a firmware update for the XDS110 Debug probe. This update breaks the cJTAG function of the XDS110. Refer to Section A.1, the FAQs, for more information on how to

resolve this issue if encountered.

1.7.2 Revision B

The second production revision of the LAUNCHXL-F280049C was released in x. This revision can be

identified by the "MCU025B" silkscreen labeling on the backside of the EVM. The fixed issues and added enhancements from the first revision (A) are described below.

Fixed issues:

• Fixed primary side power contention issue on USB Isolation IC, ADUM3160 (U3). See Section 1.7.1 for description of issue.

• Fixed J6 and J8 header errors described in Section 1.7.1

Enhancements:

• FSITXD1, FSIRXD1, and 3.3V power signals have been added to the expanded 2x5 connector J11

• XDS110 MCU (U2) TM4C129x device replaced with MSP432E401 device. Form and function have not been changed with this in any way.

• Precision reference (U11) connected to the XDS110 MCU (U2) has been removed and VREFA+ (pin

9) has been directly connected to VDDA (pin 8)

2 Hardware Description

The F28004x LaunchPad includes a F280049CPZS MCU. This MCU is well suited for advanced real-time control systems in cost-sensitive applications. A large number of these peripherals are made available to users via the on-board accessories and the BoosterPack connectors. This section explainshow those

peripherals operate and interface to the MCU

Figure 2 shows a high-level block diagram of the F28004x LaunchPad:

2.1 Functional Description and Connections

2.1.1 Microcontroller

The F280049CPZS is a 32-bit floating-point microcontroller with 256KB Flash memory, 100KB RAM, and operates at 100 MHz. It includes advanced control peripherals, differentiated analog, and various

communications peripherals. The devices has been optimized for high-performance applications and

provides a low-cost system solution. For more details, see the TMS320F28004x Piccolo microcontrollers data sheet.

Most of the microcontroller's signals are routed to 0.1 inch (2.54 mm) pitch headers laid out to comply with the TI BoosterPack standards with a few exceptions. An internal multiplexer allows different peripheral

functions to be assigned to each of the General-Purpose Input/Output (GPIO) pads. The multiplexing options can be found in the device-specific data sheet. When adding external circuitry, consider the additional load on the development board power rails.

The F28004x LaunchPad is factory-programmed with a quick start demo program. The quick start

program resides in the on-chip Flash memory and executes each time power is applied, unless the

application has been replaced with a user program. The quick start application utilizes the integrated

Analog-to-Digital Converter (ADC) module to sample the voltage on a pin, then output the results with the Serial Communications Interface (SCI) Universal Asynchronous Receiver/Transmitter (UART) through the Virtual COM port (VCP) of the XDS110 debug probe to a PC with a serial monitor running.

2.1.2 LEDs

Two power indicator LEDs are included on the board: LED0 indicates when the 3.3 V is available on the USB side of the isolation barrier and LED1 indicates when 3.3 V is available on the device side of the isolation. LED1 indicates that there is power supplied to the F28004x device as well as the XDS110

debugger.

Two user LEDs are provided on the board: LED4 (red) and LED5 (green). These user LEDs are

connected to GPIO23 and GPIO34, respectively. These are connected to the SN74LVC2G07DBVR LED driver IC and are connected in an active low configuration; that is, drive the GPIO low to turn on the LED and high to turn it off. These LEDs are dedicated for use by the software application.

Two blue LEDs, LED2 and LED3, are connected to the XDS110 debug probe. These indicate debugger activity and are not controllable by any application software.

2.1.3 Encoder Connectors

The F28004x LaunchPad includes two headers, J12 and J13, which are used for connecting linear or

rotary incremental encoders. These headers take 5 V signals that are down-converted to 3.3 V and wired to the F280049C MCU. These signals are connected to the eQEP modules on the device. Each header has the EQEPA, EQEPB, and EQEPI signals available for each eQEP module as well as pins for GND and 5 V.

2.1.4 FSI

The F28004x MCU features the industry first Fast Serial Interface (FSI). The FSI enables robust high-

speed communications and is intended to increase the amount of information transmitted while reducing the costs to communicate over an isolation barrier. Though no isolator is included on this LaunchPad, the TXCLK, TXD0, TXD1, RXCLK, RXD0, and RXD1 signals are available on J11. This header is set up in

such a way that adding jumpers on the pins will connect the TX to RX channels for external loopback and evaluation. Additionally, there are two GND signals on the connector that can be used for a wrapped-pair connection to an external board with FSI. The GPIOs connected to this header are also routed to the

BoosterPack connectors through 0Ω resistors. As the FSI can toggle at up to 100 MHz rates, the longer traces to the BoosterPack headers can create unintentional noise on the signal due to reflection.

Eliminating these extended traces by removing the in-circuit resistors will help to limit any noise or reflections.

2.1.5 CAN

The F28004x LaunchPad includes a connector for a CAN network through J14. GPIO32 and GPIO33 are routed from the F280049CPZS to J14 through the on-board CAN Transceiver. GPIO33 is also wired to the FSI connector.

2.1.6 Boot Modes

The F280049C boot ROM contains bootloading software that executes every time the devices is powered on or reset. Two pins, GPIO24 and GPIO32, are wired to the Boot Select switch (S2). Note that S2 is

placed upside down, so the OFF (open) position corresponds to a logic 1 and the ON (closed) position

corresponds to 0. By default, both pins are set to the OFF position so the device will boot from Flash. For more information on the F28004x boot modes, see the TMS320F28004x Piccolo microcontrollers data sheet.

2.1.7 BoosterPack Headers

2.1.7.1 BoosterPack Sites

The F28004x LaunchPad features two fully independent BoosterPack XL connectors. BoosterPack site #1, located above the F28004x MCU and below the XDS110 debugger, is compliant with the BoosterPack

standard with a few exceptions as noted in Figure 3. BoosterPack site #2, located under the F28004x MCU, is compliant with the BoosterPack standard with a few exceptions as well, noted in Figure 3. To expand the functions available to the user on this LaunchPad, some signals are also routed to alternate locations on the board. These alternate routes can be selected by manipulating the onboard switches or adding or removing 0 Ω resistors. This is described in Section 2.3.

The GPIO pin number as well as the BoosterPack compliant features are listed in Figure 3. Each GPIO has multiple functions available through the GPIO mux. A few special functions have also been listed

above; the full GPIO mux table can be found in theTMS320F28004x Piccolo microcontrollers data sheet.

2.1.8 Analog Voltage Reference Header

The analog subsystem of the F28004x allows for flexible voltage reference sources. The ADC and DAC modules are referenced to the VREFHIx and VREFLOx pin voltages. VREFHIx can either be driven

externally or can be generated by an internal bandgap voltage reference. An external voltage can be supplied to header J15 as an external voltage source for VREFHIx. Note that there is no signal

conditioning circuitry in place for the voltage reference. For best performance, some additional circuitry may be required.

2.1.9 Other Headers and Jumpers

The Piccolo LaunchPad has multiple jumpers to select different power sources for the board. This

LaunchPad also provides a way to isolate the connected USB from the device, allowing for safe operation and debugging in high-voltage applications.

2.1.9.1 USB Isolation Block

JP1, JP2, and JP3 are provided to enable isolation between the device and the connected USB in high-voltage applications. The area of isolation is defined by the white outline in the upper-left corner of the

LaunchPad. JP1 separates the GND of USB region and the MCU region of the LaunchPad. JP2 separates 3.3 V, and JP3 separates 5 V. By default, all three jumpers are shorted and the power is supplied by the connected USB, meaning that the USB is NOT isolated from the MCU region. If power isolation is desired, remove the supplied shunts from JP1, JP2, and JP3. In this configuration, a 3.3 V supply must be

connected to the MCU region to power the F280049C MCU and the other on-board circuitry, including the XDS110 debug probe. Some applications may not require 5 V to be supplied to the MCU region. In an

isolated power application with JP3 removed, supplying 5 V to the MCU region is optional.

2.1.9.2 BoosterPack Site 2 Power Isolation

JP8 is included to isolate 3.3 V and 5 V from the BoosterPack 2 headers. This might be required if two

BoosterPacks are simultaneously connected to the LaunchPad and both provide power to the LaunchPad. If this is the case, power can be isolated by removing the shunts on JP8 and there will be no contention between the two BoosterPacks.

2.1.9.3 Alternate Power

Additional jumpers are provided outside of the BoosterPack connector for additional external power connections for 3.3 V or 5 V. These can be used to supply an external board or for powering the

LaunchPad with an external supply. When using these connection points, ensure that no other power supplies are connected.

JP4 and JP6 are provided as extra connection points for a 3.3 V supply to be connected to the LaunchPad.

JP5 and JP7 are provided as extra connection points for a 5 V supply to be connected to the LaunchPad.

2.1.9.4 5 V Step-up Converter

JP9 isolates the output of the LMR2421 Simple Switcher step-up voltage regulator(U3) from the 5 V power

domain of the LaunchPad. This voltage regulator can step up 3.3 V to 5 V if no other 5 V supply is

connected. Do not place a shunt on J9 unless JP3 is open and no other 5 V supply is connected to the LaunchPad.

2.1.10 PGA

The F28004x MCU features on-chip Programmable Gain Amplifiers (PGA) to amplify an input voltage for increasing the dynamic range of the downstream ADC and CMPSS modules. The integrated PGA helps to

reduce the cost and design effort for many control applications that traditionally require external, stand-alone amplifiers. On-chip integration ensures that the PGA is compatible with the downstream ADC and CMPSS modules. Software selectable gain and filter settings make the PGA adaptable to various

performance needs. For more information on the PGAs, see the device-specific data sheet and TRM.

The F28004x LaunchPad was designed to optimize the routing of certain PGA signals to the BoosterPack connectors. This design choice allows for the evaluation of the on-chip PGA, if desired. Three PGA

modules are routed each BoosterPack Connector. An RC filter can be placed on each of these signals to provide additional filtering of the input signal. By default, 0 Ω series resistor and pads for a decoupling

capacitor are placed on each PGA input signal. These values can be modified based on application requirements.

In addition to the PGA input signals, BoosterPack site 2 has the associated output filter signals routed.

Each output filter signal has two components: a 0 Ω series resistor and a decoupling capacitor. If the PGA output filters are used, remove the 0 Ω series resistor to isolate it from the BoosterPack connector, and

place an appropriate filter capacitor. By default, a 330 pF capacitor is populated. An isolated ground plane for the PGAs has been created to help limit outside noise coupling onto the PGA signals. By default, this

ground plane is shorted to the ground plane of the PCB through a resistor. If isolation between PGAx_GND and the PCB ground is needed the resistor can be removed

Wherever a PGA signal is brought to the BoosterPack connector, an ADC input is also provided. Depending on the signal, the ADC is connected by either a short on the board or through on-chip connections. Other than PGA4_IN and PGA6_IN, each PGA input signal can be isolated from the connected ADC signal by removing the 0 Ω resistor that is part of the input RC filter.